LTCC Package Market Report Spreads In 112 Pages with 160 Tables and Figures
LTCC Package Market 2023 : Highlights
The global LTCC Package market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2023 and 2028.
North American market for LTCC Package is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
Asia-Pacific market for LTCC Package is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2022 through 2028.
The major global companies of LTCC Package include Murata, Kyocera (AVX), TDK Corporation, Mini-Circuits, Taiyo Yuden, Samsung Electro-Mechanics, Yokowo, KOA (Via Electronic) and Hitachi Metals, etc. In 2021, the world’s top three vendors accounted for approximately % of the revenue.
The global market for LTCC Package in Consumer Electronics is estimated to increase from $ million in 2022 to $ million by 2028, at a CAGR of % during the forecast period of 2022 through 2028.
Considering the economic change due to COVID-19 and Russia-Ukraine War Influence, LTCC Package Shell, which accounted for % of the global market of LTCC Package in 2021, is expected to reach million US$ by 2028, growing at a revised CAGR of % from 2022 to 2028.
Top Key Players:
- Kyocera (AVX)
- TDK Corporation
- Taiyo Yuden
- Samsung Electro-Mechanics
- KOA (Via Electronic)
- Hitachi Metals
- Adamant Namiki
- IMST GmbH
- API Technologies (CMAC)
- NEO Tech
- ACX Corp
- Walsin Technology
- Shenzhen Sunlord Electronics
- BDStar (Glead)
- Fenghua Advanced Technology
- YanChuang Optoelectronic Technology
- CETC 43rd Institute
- Elit Fine Ceramics
LTCC Package Market By Applications
- Consumer Electronics
- Aerospace and Military
- Automobile Electronics
LTCC Package Market By Types
- LTCC Package Shell
- LTCC Package Substrate
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